Simon contributed to a recent Nature publication establishing mechanophore cross-linking as a design principle for converting commodity polymers into impact-resilient materials. Access via DOI link: Z. Sang et al., “Mechanophore cross-linking enhances ballistic energy dissipation of polymers,” Nature, vol. 654, no. 8117, pp. 85–91, Jun. 2026, doi: 10.1038/s41586-026-10557-w.

Recent publication in Journal of Applied Physics studying hot-spot induced damage via a surrogate model informed by MD and continuum simulation data. Access via DOI link: C. Yuan, A. Riaño, and M. Koslowski, “Dynamic hot spot induced damage in energetic materials using a hot-spot surrogate model,” Journal of Applied Physics, vol. 139, no. 6, p.…

Recent publication in Journal of Applied Physics investigating PETN thin films during thermal aging via physical vapor deposition and aging simulations. Access via DOI link: A. M. Pham, J. M. Monti, R. Dingreville, D. L. Damm, and M. Koslowski, “Microstructural evolution of PETN thin films during thermal aging,” Journal of Applied Physics, vol. 139, no.…

Russell contributed to a Journal of Applied Physics publication presenting a mesoscale modeling approach for shock-induced chemical reactions in Ni+Al multilayers. Access via DOI link: D. E. Kittell et al., “Investigating shock-induced chemical reactions in Ni+Al multilayers: A continuum-based mesoscale approach with Arrhenius kinetics and artificial thermal conduction,” Journal of Applied Physics, vol. 139, no.…

Recent publication on high velocity impact and recrystallization of aluminum microparticles on JMPS. This work can be accessed with the link https://authors.elsevier.com/a/1kIE157Zk992L C. Yuan and M. Koslowski, “Grain refinement in metal microparticles subjected to high impact velocities,” Journal of the Mechanics and Physics of Solids, vol. 196, p. 106009, Mar. 2025, doi: 10.1016/j.jmps.2024.106009.

Recent publication in MSMSE on corrosion of Cu-Al interconnects. Kai-chieh Chiang and Marisol Koslowski, Corrosion-induced fracture of Cu–Al microelectronics interconnects, Modelling and Simulation in Materials Science and Engineering, 32, 045004, 2024. https://doi.org/10.1088/1361-651X/ad33de

Congratulations to all of our presenters at TMS 2024 in Orlando Florida! Fariha, Jack, Andrew, Diane, and Chongxi presented their results to other graduate students and leading scientists in their respective fields. Fariha’s Presentation: Anisotropic Effects in Electromigration Enhanced Intermetallic Growth in Sn Based Solders Jack’s Presentation: Corrosion Induced Fracture of Cu/Al Interconnects in Microelectronics…

We are excited to welcome several new members to the group! Fariha Haq, who joined us in Spring 2023. Josh Block and Alexis Byerly, who will be joining us in Fall 2023.

Watch Professor Koslowski present at IPAM here!

Congratulations to Kai-chieh on receiving the Dr. Chu Scholarship https://engineering.purdue.edu/ME/News/2022/purdue-me-grad-students-receive-fellowships-and-scholarships