Congratulations to all of our presenters at TMS 2024 in Orlando Florida! Fariha, Jack, Andrew, Diane, and Chongxi presented their results to other graduate students and leading scientists in their respective fields.

Fariha’s Presentation: Anisotropic Effects in Electromigration Enhanced Intermetallic Growth in Sn Based Solders

Jack’s Presentation: Corrosion Induced Fracture of Cu/Al Interconnects in Microelectronics Packages

Andrew’s Presentation: Phase Field Simulations of Thermal Aging of Energetic Materials Thin Films

Diane’s Poster: Influence of Void Shape on the Propagation of Cracks in Energetic Materials

Chongxi’s Presentation: Local Deformation and Recrystallization during High-velocity Impact of Metallic Particles

See abstracts on TMS 2024 Website